What is FIPFG (Formed-In-Place Foam Gasket)?

FIPFG is an automated sealing process that dispenses a continuous bead of two-component polyurethane foam directly onto a substrate — typically a plastic enclosure or housing. The foam cures at room temperature in minutes and bonds permanently to the substrate, replacing die-cut, extruded or moulded gaskets. Vesimentor's FIPFG line is robot-controlled with a precision metering pump.

What sealing performance does FIPFG provide?

Vesimentor's FIPFG bead achieves IP54 to IP67 protection depending on bead geometry and substrate flatness. The bead can be programmed in 2-8 mm width with custom cross-sections. The foam compresses elastically when the cover is closed and returns to its original shape when reopened — enabling repeated opening cycles without leakage.

Which substrates can be sealed with FIPFG?

FIPFG works on ABS, PC, PC/ABS, PA, PMMA, glass-fibre reinforced thermoplastics, painted and metallized surfaces. Vesimentor moulds the substrate in the same factory, so material selection accounts for the FIPFG bond strength from the design stage.

What is the difference between FIPFG and die-cut gaskets?

Die-cut and extruded gaskets are produced separately and assembled by hand — this introduces handling cost, inventory and tolerance stack-up. FIPFG places the bead directly on the part with sub-millimetre precision and no separate handling. For volumes above ca 500 pcs/year, FIPFG is typically more cost-effective and far more reliable than manual gasket assembly.

What volumes is FIPFG cost-effective for?

FIPFG becomes economical at low-volume runs (from ca 100 pcs/year) and scales to series production (10 000+ pcs/year). The setup cost is the dispensing program; per-part cost is dominated by foam consumption and cycle time.

Do you offer electronics potting alongside FIPFG?

Yes. Vesimentor's same dispensing equipment delivers two-component PU potting compounds for PCB, sensor and LED-module encapsulation — protecting the electronics from vibration, moisture and EMI. FIPFG and electronics potting are offered as combined services with the moulded plastic substrate.

What certifications does Vesimentor hold?

ISO 9001 (Quality Management), ISO 14001 (Environmental Management) and AQAP 2110 (NATO Quality Requirements for Design and Production). The combination — particularly AQAP 2110 — is rare among plastic contract manufacturers in the Baltic-Nordic region and qualifies Vesimentor for defence and security-critical programmes.

Potting & FIPFG Gasket Sealing · Estonia

Integrated FIPFG Gasket Sealing and Electronics Potting

Vesimentor has invested in a unique value-adding process for its in-house plastic production: robot-controlled Formed-In-Place Foam Gasket (FIPFG) sealing and electronics potting, applied exclusively to plastic parts we have produced ourselves. As a specialised FIPFG sealing manufacturer in Pärnu, Estonia, we deliver moulded, sealed and assembled components from a single facility — one supplier, one quality record, one shipment ready to install.

Why In-House Substrate Only

FIPFG and potting are chemical bonding processes. Their result depends directly on the condition of the plastic surface: dust, release-agent residue, moisture, micro-contamination, flash and out-of-tolerance dimensions all degrade adhesion, bead geometry and long-term ingress protection. When the forming and the sealing take place in the same facility, we control the substrate from granulate to finished assembly — surface cleanliness, dimensional accuracy, storage conditions and the time window between processes. This is why Vesimentor seals and pots only parts we have produced ourselves. For the customer it means one specification, one process validation, one supplier quality agreement — and a gasket that performs as designed across its service life.

Equipment and Technical Capability

Our sealing line combines a two- and three-component low-pressure mixing and dosing system with a highly dynamic three-axis linear robot — a contour-accurate FIPFG and potting platform suited to both serial production and complex small-batch work.

Process types: FIPFG foam gasket sealing, potting and encapsulation, adhesive dispensing
Materials processed: 2K polyurethane foam (closed-cell and mixed-cell), polyurethane casting resins, silicones, epoxy resins
Ingress protection: IP65 and IP66 as standard outcomes; IP67 achievable with correctly specified geometry and material
Batch sizes: prototype, pilot series and medium-volume serial production

Upstream in-house production feeding the sealing line covers two main plastic forming routes: injection moulding with clamping forces up to 500 tonnes, across a broad range of engineering thermoplastics including PA, PE, PP, ABS, POM, PC and filled or reinforced grades, and rotational moulding for larger hollow components. Every sealed assembly — whether an injection-moulded enclosure or a rotomoulded component — carries substrate traceability from the raw material through to the finished gasket or potting.

The Integrated Process

DFM and co-design. Our engineers review the part geometry, sealing groove, bead path, venting and draft angles against the target IP class and operating environment — before the part goes into production.
In-house substrate production. The plastic substrate is produced in our own facility — by injection moulding or rotational moulding — with process windows locked in and traceable.
Fixturing and robotic application. Parts are loaded into dedicated sealing fixtures and a linear robot applies the contour-accurate foam bead or dispenses the programmed potting volume — no external logistics, no re-packaging, no contamination window between forming and sealing.
Curing and inspection. Parts cure under controlled conditions and are inspected for bead continuity, bead height and dimensional conformity.
Assembly and dispatch. Sealed parts can be assembled with further components in-house and shipped ready to install.

Materials and Standards

Sealing materials are selected with the customer against the duty cycle of the part — operating temperature, chemical exposure, UV load, flame class and required IP rating. Qualified material families include 2K polyurethane foams, polyurethane casting resins, silicone systems and epoxy potting compounds. Material qualification records, process parameters and batch traceability can be maintained for every production run, if needed and agreed, supporting customer audits, PPAP submissions and change control throughout the product lifecycle.

Vesimentor is certified to ISO 9001 (quality management), ISO 14001 (environmental management) and AQAP 2110 (NATO quality requirements for design, development and production). For defence and critical-infrastructure programmes, AQAP 2110 is a qualifying criterion that remains exceptionally rare among FIPFG subcontractors in the Baltic and Nordic region.

Typical Applications

Electronics and electrical: control cabinets, electrical cabinet covers, junction boxes, sensor housings, bus validator enclosures, industrial enclosures requiring IP65+
Lighting: outdoor luminaires and LED housings
Telecommunications: outdoor cabinets, fibre distribution boxes, gateway housings
Automotive and e-mobility: charging station service panels, battery module components, interior lighting
Defence and security: ruggedised enclosures and mission-critical housings, supported by AQAP 2110
Industrial equipment: HVAC covers, filter housings, pump doors and actuator casings

Why Vesimentor

Integrated supplier — moulded, sealed, ship-ready. Moulding, sealing, assembly and dispatch from one facility. One quality system, one delivery, one accountable partner.
Substrate control. FIPFG and potting only on parts we have produced — injection-moulded or rotomoulded — the only way to guarantee adhesion, bead geometry and long-term IP performance.
Nearshoring to the Nordics and Central Europe. Pärnu offers short lead times and direct road and ferry links to Helsinki, Stockholm, Riga and continental Europe, with EU-level IP protection and communication.
Defence-grade quality system. ISO 9001 + ISO 14001 + AQAP 2110, auditable end to end.

Request a Quotation

Send us your drawings, 3D models or sealing specification. Our engineering team will respond with a feasibility assessment, material recommendation and indicative pricing for the complete moulded-and-sealed assembly.

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Vesimentor OÜ · Kase tn 10, 80047 Pärnu, Estonia

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FIPFG machine and process — automated foam gasket dispensing

Our Formed-In-Place Foam Gasket (FIPFG) line uses a robot-controlled dispensing head with a precision metering pump for two-component polyurethane. The system places a continuous PU foam bead directly onto the substrate — typically a plastic enclosure we have moulded ourselves — following a programmable 3D path. Cure happens at room temperature within minutes; the gasket bonds permanently to the substrate without secondary fixing.

FIPFG machine — robot-guided dispensing, dosing tolerance ±0.01 g, repeatable bead geometry.
Suitable substrates — ABS, PC, PC/ABS, PA, PMMA, glass-fibre reinforced thermoplastics, painted and metallized surfaces.
Bead profile — 2-8 mm wide, programmable cross-section.
Sealing performance — IP54 to IP67 depending on bead geometry and substrate flatness.
Production volumes — economical from low-volume (100+) to series production (10 000+ pcs/year).

FIPFG replaces die-cut gaskets and reduces handling, inventory and assembly time. The same factory delivers the moulded plastic part, the gasket, optional vacuum metallizing and CNC finishing in one delivery — FIPFG Estonia for Baltic and Nordic OEMs.

Frequently Asked Questions about FIPFG and Electronics Potting

What is FIPFG (Formed-In-Place Foam Gasket)?: FIPFG is an automated sealing process that dispenses a continuous bead of two-component polyurethane foam directly onto a substrate — typically a plastic enclosure or housing. The foam cures at room temperature in minutes and bonds permanently to the substrate, replacing die-cut, extruded or moulded gaskets. Vesimentor's FIPFG line is robot-controlled with a precision metering pump.
What sealing performance does FIPFG provide?: Vesimentor's FIPFG bead achieves IP54 to IP67 protection depending on bead geometry and substrate flatness. The bead can be programmed in 2-8 mm width with custom cross-sections. The foam compresses elastically when the cover is closed and returns to its original shape when reopened — enabling repeated opening cycles without leakage.
Which substrates can be sealed with FIPFG?: FIPFG works on ABS, PC, PC/ABS, PA, PMMA, glass-fibre reinforced thermoplastics, painted and metallized surfaces. Vesimentor moulds the substrate in the same factory, so material selection accounts for the FIPFG bond strength from the design stage.
What is the difference between FIPFG and die-cut gaskets?: Die-cut and extruded gaskets are produced separately and assembled by hand — this introduces handling cost, inventory and tolerance stack-up. FIPFG places the bead directly on the part with sub-millimetre precision and no separate handling. For volumes above ca 500 pcs/year, FIPFG is typically more cost-effective and far more reliable than manual gasket assembly.
What volumes is FIPFG cost-effective for?: FIPFG becomes economical at low-volume runs (from ca 100 pcs/year) and scales to series production (10 000+ pcs/year). The setup cost is the dispensing program; per-part cost is dominated by foam consumption and cycle time.
Do you offer electronics potting alongside FIPFG?: Yes. Vesimentor's same dispensing equipment delivers two-component PU potting compounds for PCB, sensor and LED-module encapsulation — protecting the electronics from vibration, moisture and EMI. FIPFG and electronics potting are offered as combined services with the moulded plastic substrate.
What certifications does Vesimentor hold?: ISO 9001 (Quality Management), ISO 14001 (Environmental Management) and AQAP 2110 (NATO Quality Requirements for Design and Production). The combination — particularly AQAP 2110 — is rare among plastic contract manufacturers in the Baltic-Nordic region and qualifies Vesimentor for defence and security-critical programmes.