FIPFG foam gasketing and electronics potting

Foam gasketing and potting serve different functions. The enquiry should identify whether the project needs a sealing joint, encapsulated components or both.

Foam gasketing

FIPFG applies a foam gasket directly to the component. For a housing, the gasket path, substrate, joint geometry, compression and closing arrangement must be considered together. Vesimentor can coordinate this operation with moulding and assembly.

Supplier illustration.

Potting and encapsulation

For a potting enquiry, show the components to be encapsulated and describe the operating environment and compound requirements. The material and proposed process must be reviewed for the application; foam-gasket chemistry is not automatically the appropriate potting specification.

Protection and acceptance criteria

An IP rating concerns the complete enclosure and its final assembly conditions. For either gasketing or potting, identify the required inspection and acceptance criteria instead of treating the process name as a performance guarantee.

Supplier illustration.

Information for a manufacturing review

• Part and assembly drawings, including the sealing path or encapsulation area.
• Substrate and compound requirements, where known.
• Operating conditions and the required protection or functional performance.
• Quantity, assembly scope and customer-specific documentation.

View the foam gasketing and potting service